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精!详解切片分析技术如何维护电子产品质量!

2019-03-01  浏览量:829

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JINTIAN,MEIXINJIANCEJIANGCONGSANGEFANGMIANWEIDAJIAJIESHAOQIEPIANFENXIJISHUDEYINGYONG,TONGSHITONGGUODIANXINGQIEPIANFENXIANLIDEPOUXI,GENGNENGSHENRULEJIEQIEPIANFENXIJISHUDEZUOYONG。SHOUXIAN,WOMENLAILEJIEYIXIASHENMESHIQIEFENFENXI,QIDAODISHIZENYANGDEFENXIGUOCHENG?

 

切片分析技术

足彩跟单appQIEPIANJISHU,YOUMINGQIEPIANHUOJINXIANGQIEPIAN、WEIQIEPIAN(YINGWENMING: Cross-section,X-section ),SHIYONGTEZHIYETAIHUANYANGSHUZHIJIANGYANGPINBAOGUOGUFENG,DAIHUANYANGSHUZHIGUHUAHOUDUIZHIDINGWEIZHIJINXINGYANMOPAOGUANGDEYIZHONGZHIYANGFANGFA,SHIYIZHONGGUANCHAYANGPINJIEMIANJIEGOUQINGKUANGZUICHANGYONGDEZHIYANGFENXISHOUDUAN。(LAIYUANBAIDUBAIKE“JINXIANGQIEPIAN”CITIAOJIESHAO。)

 

切片样品制备的流程和方法

足彩跟单appYIJUXIANGGUANBIAOZHUNYAOQIU,QIEPIANYANGPINZHIBEILIUCHENGRUXIA:

取样→清洗→真空镶嵌→研磨→抛光→微蚀(如有必要)→分析(OM观察、SEM观察、EDS分析、EBSD分析等)

 

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美信检测

 

由对比图和表格我们可以看到,离子研磨较之普通的机械研磨更为优秀,能够避免损伤和污染样品表面,达到镜面研磨效果,露出样品内部真实的形貌;同时,离子研磨还是一种无应力的加工方式,不会在制样的过程中使样品产生形变,影响分析结果。

足彩跟单appYINCI,MEIXINJIANCEYIZHICAIYONGLIZIYANMOPAOGUANGZHIYANGJISHULAIZHIBEIQIEPIANYANGPIN。

 

切片方法分类

一般的微切片方法可分成纵切片(沿垂直于板面的方向切开)和水平切片(沿平行于板面的方向切开),除此之外也有切孔和斜切片方法。

切片分析是对样品进行破坏性试验的技术手段,是电子制造行业中最常见的也是最重要的分析方法之一,前期切片样品制备质量的好坏将直接影响失效部位观察、分析的准确性。

 

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切片分析技术在电子产品质量把控方面的三大应用:

1.印制线路板的检验

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美信检测

 

美信检测

 

2.电子组件的检验

MUDE:JIEZHUQIEPIANFENXIJISHUHESAOMIAODIANJINGDENGYIQILIANYONG,QUERENDIANZIYUANQIJIANDESHIXIAOXIANXIANG,FENXIGONGYI、YUANCAILIAOQUEXIAN。TONGGUOXIANWEIPOUQIEJISHUZHIDEDEWEIQIEPIANKEYONGYUDIANZIYUANQIJIANJIEGOUPOUXI、JIANCHADIANZIYUANQIJIANBIAOMIANJINEIBUQUEXIANJIANCHA。

 

美信检测

 

美信检测

 

3.LCD屏幕的检验

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美信检测

 

美信检测

 

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*** YISHANGNEIRONGJUNWEIYUANCHUANG,RUXUZHUANZAI,QINGZHUMINGCHUCHU ***

 

简介

MTT(美信检测)是一家从事材料及零部件品质检验、鉴定、认证及失效分析服务的第三方实验室,网址:bixinshuma.com足彩跟单app,联系电话:400-850-4050。

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